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Journal of Thermal Science
热科学学报
Journal of Thermal Science
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Submission
Evaluation of Novel Junction Film Holes for Improving Film Cooling Performance
HE Juan, CHEN Lei, NI Qin, XIAO Kun, PENG Hao
Journal of Thermal Science . 2025, (
4
): 1431 -1449 . DOI: 10.1007/s11630-025-2143-0
