Evaluation of Novel Junction Film Holes for Improving Film Cooling Performance

HE Juan, CHEN Lei, NI Qin, XIAO Kun, PENG Hao

Journal of Thermal Science ›› 2025, Vol. 34 ›› Issue (4) : 1431-1449.

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Journal of Thermal Science

热科学学报
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Journal of Thermal Science ›› 2025, Vol. 34 ›› Issue (4) : 1431-1449. DOI: 10.1007/s11630-025-2143-0  CSTR: 32141.14.JTS-025-2143-0

Evaluation of Novel Junction Film Holes for Improving Film Cooling Performance

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2025, 34(4): 1431-1449 https://doi.org/10.1007/s11630-025-2143-0

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