Heat and mass transfer

Prediction of Equivalent Thermal Conduction Resistance of Printed Circuit Heat Exchangers

  • SHI Haoning ,
  • CHANG Hongliang ,
  • MA Ting ,
  • WANG Qiuwang
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  • Key Laboratory of Thermo-Fluid Science and Engineering, MOE, Xi’an Jiaotong University, Xi’an 710049, China

Online published: 2023-12-04

Supported by

This work is supported by the State Key Program of National Natural Science Foundation of China (No. 51536007), the Foundation for Innovative Research Groups of the National Natural Science Foundation of China (Grant No. 51721004), the Program of Introducing Talents of Discipline to Universities Project (Grant No. B16038), and the Fundamental Research Funds for the Central Universities. The authors are grateful to Dr. SUN Xiaodong (University of Michigan, Ann Arbor) for the helpful discussions and valuable comments on this work.

Copyright

Science Press, Institute of Engineering Thermophysics, CAS and Springer-Verlag GmbH Germany, part of Springer Nature 2022

Abstract

Printed circuit heat exchangers (PCHEs) have great potential to be employed in the advanced nuclear reactor systems. In this work, the equivalent thermal conduction resistance of PCHE is studied. The influences of thermal convection resistance are analyzed. The results indicate that the equivalent thermal conduction resistance of PCHEs with unequal numbers of hot plates and cold plates are sensitive to the thermal convection resistance of hot side and cold side. Specifically, for case C which has unequal number of hot and cold channels, the maximum value of equivalent thermal conduction resistance can be 1.7–2.4 times the minimum value. The equivalent thermal conduction resistance is underestimated under the isothermal boundary. In addition, the non-uniformity of the lengths of all the heat flux lines determines the influence degree of thermal convection resistance on the equivalent thermal conduction resistance. For further investigation, Latin hypercube sampling method is adopted to generate a large number of design points for each PCHE configuration. Based on the sample data, mathematical correlations and artificial neural network (ANN) for prediction of equivalent thermal conduction resistance for each case are developed. The proposed correlations of equivalent thermal conduction resistance for each case have acceptable accuracy of prediction with a wide range covering general engineering applications. The ANN model can achieve much better prediction accuracy than the proposed correlations thus it is recommended in the cases that the prediction accuracy is considered as the priority need.

Cite this article

SHI Haoning , CHANG Hongliang , MA Ting , WANG Qiuwang . Prediction of Equivalent Thermal Conduction Resistance of Printed Circuit Heat Exchangers[J]. Journal of Thermal Science, 2022 , 31(6) : 2281 -2292 . DOI: 10.1007/s11630-022-1675-9

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