Non-Isothermal Dissolutive Wetting of Al-Ni and Cu-Ni Alloy Nanodroplets on a Cu(100) Substrate

WANG Shaoyu; WANG Zijie; WANG Shuolin; YANG Yanru; HUANG Congliang; WANG Xiaodong

doi:10.1007/s11630-022-1624-7

Journal of Thermal Science >

2022 , Vol. 31 >Issue 4: 1135 - 1144

DOI: https://doi.org/10.1007/s11630-022-1624-7

Non-Isothermal Dissolutive Wetting of Al-Ni and Cu-Ni Alloy Nanodroplets on a Cu(100) Substrate

WANG Shaoyu ,
WANG Zijie ,
WANG Shuolin ,
YANG Yanru ,
HUANG Congliang ,
WANG Xiaodong

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1. State Key Laboratory of Alternate Electrical Power System with Renewable Energy Sources, North China Electric Power University, Beijing 102206, China
2. Research Center of Engineering Thermophysics, North China Electric Power University, Beijing 102206, China
3. School of Electrical and Power Engineering, China University of Mining and Technology, Xuzhou 221116, China

Online published: 2023-12-01

Supported by

This study was partially supported by the State Key Program of National Natural Science of China (No. 51936004) and Science Fund for Creative Research Groups of the National Natural Science Foundation of China (No. 51821004).

Copyright

Science Press, Institute of Engineering Thermophysics, CAS and Springer-Verlag GmbH Germany, part of Springer Nature 2022

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Abstract

The kinetics of Al-Ni and Cu-Ni nanodroplets spreading over a Cu substrate in the presence of a temperature difference between them is studied via molecular dynamics simulations. The simulations show that significant dissolution reactions occur for the two systems and there is no precursor film generated during spreading. The spreading rate significantly increases when nanodroplets contain less Ni atoms in the Al-Ni/Cu wetting systems. However, a different trend is observed in the Cu-Ni/Cu wetting systems. The spreading rate remains unchanged regardless of the ratio of Cu to Ni atoms owing to the fact that Cu and Ni have almost the same lattice constants. The simulations also demonstrate that, because of the temperature gradient between the nanodroplet and substrate, local solidification takes place in the later spreading stage, which significantly hinders spreading. Due to the mismatch of lattice constants between Al and the Cu atoms in the Al-Ni/Cu wetting systems, hexagonal closest packed (hcp), body centered cubic (bcc), and face centered cubic (fcc) arrangements of atoms are observed when the Al-Ni nanodroplets solidify completely, whereas there is only a fcc arrangement in the Cu-Ni/Cu wetting systems.

Key words： spreading mechanism; non-isothermal; solidification; molecular dynamics simulations

Cite this article

WANG Shaoyu , WANG Zijie , WANG Shuolin , YANG Yanru , HUANG Congliang , WANG Xiaodong . Non-Isothermal Dissolutive Wetting of Al-Ni and Cu-Ni Alloy Nanodroplets on a Cu(100) Substrate[J]. Journal of Thermal Science, 2022 , 31(4) : 1135 -1144 . DOI: 10.1007/s11630-022-1624-7

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