Large-Scale Vapor Chambers Enabled by Liquid Film Boiling for High-Power Electronics Cooling

YANG Yaoqi, HAN Zhaoyang, WANG Mengyao, JIANG Weiyu, HAO Tingting, MA Xuehu, WEN Rongfu

Journal of Thermal Science ›› 2025, Vol. 34 ›› Issue (6) : 2059-2071.

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Journal of Thermal Science

热科学学报
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Journal of Thermal Science ›› 2025, Vol. 34 ›› Issue (6) : 2059-2071. DOI: 10.1007/s11630-025-2202-6

Large-Scale Vapor Chambers Enabled by Liquid Film Boiling for High-Power Electronics Cooling

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2025, 34(6): 2059-2071 https://doi.org/10.1007/s11630-025-2202-6

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