Optimization of Thermal Conductivity of Alumina-Filled Composites by Numerical Simulations

LI Shikun, LIU Bin, JIA Xiao, XU Min, ZONG Ruoyu, LIU Guohua, HUAI Xiulan

Journal of Thermal Science ›› 2023, Vol. 32 ›› Issue (4) : 1569-1582.

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Journal of Thermal Science

热科学学报
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Journal of Thermal Science ›› 2023, Vol. 32 ›› Issue (4) : 1569-1582. DOI: 10.1007/s11630-023-1827-6

Optimization of Thermal Conductivity of Alumina-Filled Composites by Numerical Simulations

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2023, 32(4): 1569-1582 https://doi.org/10.1007/s11630-023-1827-6

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