×
模态框（Modal）标题
在这里添加一些文本
Close
Close
Submit
Cancel
Confirm
×
模态框（Modal）标题
×
Chinese
Journal of Thermal Science
热科学学报
Journal of Thermal Science
Home
Articles & Issue
Current Issue
All issues
Special issues and article collections
Archive by Fields
Most Accessed
Video
About
Aims and scope
Editorial Board
Abstracting and indexing
News
Announcements
Contact Us
Download center
Guide for Authors
Call for papers
Writing Guide
Copyright
Article processing charge
Submission
A Detailed Thermal Resistance Network Analysis of FCBGA Package
DANG Hao, LU Yang, DU Yanzheng, ZHANG Xiu, ZHANG Qian, MA Weigang, ZHANG Xing
Journal of Thermal Science . 2024, (
1
): 18 -28 . DOI: 10.1007/s11630-023-1903-y
