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Journal of Thermal Science
热科学学报
Journal of Thermal Science
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Numerical Simulation Study on Cooling Characteristics of a New Type of Film Hole;一种新型气膜孔冷却特性的数值模拟研究
GUO Chunhai; WANG Bin; KANG Zhenya
Journal of Thermal Science . 2021, (
1
): 210 -219 . DOI: 10.1007/s11630-020-1288-0
