A Detailed Thermal Resistance Network Analysis of FCBGA Package

DANG Hao, LU Yang, DU Yanzheng, ZHANG Xiu, ZHANG Qian, MA Weigang, ZHANG Xing

Journal of Thermal Science ›› 2024, Vol. 33 ›› Issue (1) : 18-28.

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Journal of Thermal Science

热科学学报
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Journal of Thermal Science ›› 2024, Vol. 33 ›› Issue (1) : 18-28. DOI: 10.1007/s11630-023-1903-y

A Detailed Thermal Resistance Network Analysis of FCBGA Package

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2024, 33(1): 18-28 https://doi.org/10.1007/s11630-023-1903-y

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