Thermal and Structural Insight into Lightweight Lattice Channels for Active Cooling Technology

YANG Zenan, LUO Xiaobo, CHEN Wei, JU Yinchao, ZHANG Bo

Journal of Thermal Science ›› 2023, Vol. 32 ›› Issue (3) : 1049-1062.

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Journal of Thermal Science ›› 2023, Vol. 32 ›› Issue (3) : 1049-1062. DOI: 10.1007/s11630-023-1791-1

Thermal and Structural Insight into Lightweight Lattice Channels for Active Cooling Technology

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2023, 32(3): 1049-1062 https://doi.org/10.1007/s11630-023-1791-1

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