A Model to Evaluate the Device-Level Performance of Thermoelectric Cooler with Thomson Effect Considered

GONG Tingrui, GAO Lei, WU Yongjia, TAN Haoshu, QIN Feng, XIN Xiong, SHEN Limei, LI Juntao, MING Tingzhen

Journal of Thermal Science ›› 2022, Vol. 31 ›› Issue (3) : 712-726.

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Journal of Thermal Science ›› 2022, Vol. 31 ›› Issue (3) : 712-726. DOI: 10.1007/s11630-022-1591-z
Heat and mass transfer

A Model to Evaluate the Device-Level Performance of Thermoelectric Cooler with Thomson Effect Considered

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2022, 31(3): 712-726 https://doi.org/10.1007/s11630-022-1591-z

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