A Strategy to Reduce the Peak Temperature of the Chip Working under Dynamic Power Using the Transient Cooling Effect of the Thin-Film Thermoelectric Cooler

WU Yongjia, CHEN Sen, GONG Tingrui, SHI Tianhao, ZUO Lei, YAN Yonggao, FANG Yueping, MING Tingzhen

热科学学报 ›› 2022, Vol. 31 ›› Issue (4) : 1094-1105.

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Journal of Thermal Science

热科学学报
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热科学学报 ›› 2022, Vol. 31 ›› Issue (4) : 1094-1105. DOI: 10.1007/s11630-022-1637-2  CSTR: 32141.14.JTS-022-1637-2

A Strategy to Reduce the Peak Temperature of the Chip Working under Dynamic Power Using the Transient Cooling Effect of the Thin-Film Thermoelectric Cooler

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A Strategy to Reduce the Peak Temperature of the Chip Working under Dynamic Power Using the Transient Cooling Effect of the Thin-Film Thermoelectric Cooler

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{{article.zuoZheCn_L}}. {{article.title_cn}}[J]. {{journal.qiKanMingCheng_CN}}, 2022, 31(4): 1094-1105 https://doi.org/10.1007/s11630-022-1637-2
{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2022, 31(4): 1094-1105 https://doi.org/10.1007/s11630-022-1637-2
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