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A Model to Evaluate the Device-Level Performance of Thermoelectric Cooler with Thomson Effect Considered

  • GONG Tingrui ,
  • GAO Lei ,
  • WU Yongjia ,
  • TAN Haoshu ,
  • QIN Feng ,
  • XIN Xiong ,
  • SHEN Limei ,
  • LI Juntao ,
  • MING Tingzhen
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  • 1. Microsystem & Terahertz Research Center, China Academy of Engineering Physics, Chengdu 610200, China
    2. Institute of Electronic Engineering, China Academy of Engineering Physics, Mianyang 621999, China
    3. School of Civil Engineering and Architecture, Wuhan University of Technology, Wuhan 430070, China
    4. Department of Refrigeration & Cryogenics Engineering, Huazhong University of Science and Technology, Wuhan 430074, China

网络出版日期: 2023-12-01

基金资助

This study was financially supported by the National Natural Science Foundation of China (NSFC) (Grant No. 52106032), the Science Challenge Program (Grant No. TZ2018003), the National Natural Science Foundation of China (Grant No. 51778511), the Hubei Provincial Natural Science Foundation of China (Grant No. 2018CFA029), and the Key Project of ESI Discipline Development of Wuhan University of Technology (WUT Grant No. 2017001).

版权

Science Press, Institute of Engineering Thermophysics, CAS and Springer-Verlag GmbH Germany, part of Springer Nature 2022

A Model to Evaluate the Device-Level Performance of Thermoelectric Cooler with Thomson Effect Considered

  • GONG Tingrui ,
  • GAO Lei ,
  • WU Yongjia ,
  • TAN Haoshu ,
  • QIN Feng ,
  • XIN Xiong ,
  • SHEN Limei ,
  • LI Juntao ,
  • MING Tingzhen
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  • 1. Microsystem & Terahertz Research Center, China Academy of Engineering Physics, Chengdu 610200, China
    2. Institute of Electronic Engineering, China Academy of Engineering Physics, Mianyang 621999, China
    3. School of Civil Engineering and Architecture, Wuhan University of Technology, Wuhan 430070, China
    4. Department of Refrigeration & Cryogenics Engineering, Huazhong University of Science and Technology, Wuhan 430074, China

Online published: 2023-12-01

Supported by

This study was financially supported by the National Natural Science Foundation of China (NSFC) (Grant No. 52106032), the Science Challenge Program (Grant No. TZ2018003), the National Natural Science Foundation of China (Grant No. 51778511), the Hubei Provincial Natural Science Foundation of China (Grant No. 2018CFA029), and the Key Project of ESI Discipline Development of Wuhan University of Technology (WUT Grant No. 2017001).

Copyright

Science Press, Institute of Engineering Thermophysics, CAS and Springer-Verlag GmbH Germany, part of Springer Nature 2022

摘要

本文在考虑汤姆森效应、接触热(电)阻、封装间隙热泄漏、热沉热阻以及热负荷影响的基础上,建立一维的热力学模型以评估热电制冷器件(TEC)的器件级性能。通过引入无量纲参数对性能预测模型进行简化和推广。性能预测结果与实验测试结果吻合度良好。通过参数化分析表明,汤姆森效应对TEC制冷量的影响随着电流的增加而不断增大,而对COP的影响几乎不随电流变化。与接触电阻相比,低的接触热阻更有利于获得较低的TEC热结温度,在案例研究中可以降低 2 K。封装间隙热泄漏是影响制冷性能的不利因素。当热沉的热阻较小时,热泄漏对TEC制冷性能的不利影响会进一步扩大。增加热负荷温有利于提升TEC的制冷能力。例如,热负荷每增加 5 K,制冷性能可以增加约 4%。但是,一旦电流超过最佳值,对性能的提升作用就会减弱。本研究将为从事TEC系统优化的设计人员提供一种分析方法。

本文引用格式

GONG Tingrui , GAO Lei , WU Yongjia , TAN Haoshu , QIN Feng , XIN Xiong , SHEN Limei , LI Juntao , MING Tingzhen . A Model to Evaluate the Device-Level Performance of Thermoelectric Cooler with Thomson Effect Considered[J]. 热科学学报, 2022 , 31(3) : 712 -726 . DOI: 10.1007/s11630-022-1591-z

Abstract

In this paper, a one-dimensional thermodynamic model was developed to evaluate the device-level performance of thermoelectric cooler (TEC) with the Thomson effect, contact resistance, gap heat leakage, heat sink, and heat load taken into account. The model was generalized and simplified by introducing dimensionless parameters. Experimental measurements showed good agreement with analytical results. The parametric analysis indicated that the influence of the Thomson effect on cooling capacity continued to expand with increasing current, while the effect on COP hardly changed with current. Low thermal contact resistance was beneficial to obtain lower hot-junction temperature, which can even reduce 2 K compared with the electrical contact resistance in the case study. The gap heat leakage was a negative factor affecting the cooling performance. When the thermal resistance of the heat sink was small, the negative effect of heat leakage on performance would be further enlarged. The enhancement of heat load temperature would increase the cooling power of the TEC. For example, an increase of 5 K in heat load can increase the cooling capacity by about 4%. However, once the current exceeded the optimum value, the raising effect on the cooling power would be weakened. The research can provide an analytical approach for the designer to perform trade studies to optimize the TEC system.

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