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Journal of Thermal Science

热科学学报

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2025 , Vol. 34 >Issue 6: 2059 - 2071

DOI: https://doi.org/10.1007/s11630-025-2202-6

Large-Scale Vapor Chambers Enabled by Liquid Film Boiling for High-Power Electronics Cooling

  • YANG Yaoqi ,
  • HAN Zhaoyang ,
  • WANG Mengyao ,
  • JIANG Weiyu ,
  • HAO Tingting ,
  • MA Xuehu ,
  • WEN Rongfu
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  • 1. State Key Laboratory of Fine Chemicals, Frontier Science Center for Smart Materials, Dalian University of Technology, Dalian 116024, China
    2. Liaoning Key Laboratory Clean Utilization of Chemical Resources, School of Chemical Engineering, Dalian University of Technology, Dalian 116024, China

网络出版日期: 2025-10-29

基金资助

This work is supported by the National Key Research and Development Program (Grant No. 2022YFB3806504) and the National Natural Science Foundation of China (Grant No. 52376047). We sincerely thank the Xingliao Talent Program of Liaoning Province (Grant No. XLYC2203193) and the Fundamental Research Funds for the Central Universities (Grant No. DUT24ZD201, DUT22LAB610, DUT23BK017, and DUT23BK046).

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Science Press, Institute of Engineering Thermophysics, CAS and Springer-Verlag GmbH Germany, part of Springer Nature 2025
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Large-Scale Vapor Chambers Enabled by Liquid Film Boiling for High-Power Electronics Cooling

  • YANG Yaoqi ,
  • HAN Zhaoyang ,
  • WANG Mengyao ,
  • JIANG Weiyu ,
  • HAO Tingting ,
  • MA Xuehu ,
  • WEN Rongfu
Expand
  • 1. State Key Laboratory of Fine Chemicals, Frontier Science Center for Smart Materials, Dalian University of Technology, Dalian 116024, China
    2. Liaoning Key Laboratory Clean Utilization of Chemical Resources, School of Chemical Engineering, Dalian University of Technology, Dalian 116024, China

Online published: 2025-10-29

Supported by

This work is supported by the National Key Research and Development Program (Grant No. 2022YFB3806504) and the National Natural Science Foundation of China (Grant No. 52376047). We sincerely thank the Xingliao Talent Program of Liaoning Province (Grant No. XLYC2203193) and the Fundamental Research Funds for the Central Universities (Grant No. DUT24ZD201, DUT22LAB610, DUT23BK017, and DUT23BK046).

Copyright

Science Press, Institute of Engineering Thermophysics, CAS and Springer-Verlag GmbH Germany, part of Springer Nature 2025
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摘要

随着电子设备功率密度的急剧上升与热源分布不均现象的日益突出，高效散热技术面临着严峻挑战。利用汽液相变传热过程的均热板因具备优异性能和潜在的低成本优势而受到广泛关注。然而，现有依赖毛细液膜蒸发的均热板性能受限于毛细结构的液体输运干涸问题。本文提出了一种采用分级网格毛细结构的大尺寸均热板，基于液膜沸腾模式实现了高效的大功率电子器件冷却性能。该结构采用由泡沫铜与铜粉构成的分区复合柱体，以促进蒸汽扩散输运与两相有序流动。实验研究了填充率与冷却水温度对蒸汽流动及液膜分布的影响。结果表明，热源区X形布置的复合柱可有效强化蒸汽在均热板内的扩散，在热流密度为100 W/cm2、加热面积775 mm2的条件下，热阻低至0.04 °C/W。本研究结果为高性能大尺寸均热板的结构设计提供了理论依据与设计指导。

关键词： large-scale vapor chamber; liquid film boiling; composite wicking structure; high heat flux; low thermal resistance

本文引用格式

YANG Yaoqi , HAN Zhaoyang , WANG Mengyao , JIANG Weiyu , HAO Tingting , MA Xuehu , WEN Rongfu . Large-Scale Vapor Chambers Enabled by Liquid Film Boiling for High-Power Electronics Cooling[J]. 热科学学报, 2025 , 34(6) : 2059 -2071 . DOI: 10.1007/s11630-025-2202-6

Abstract

Challenges of electronic cooling are becoming increasingly urgent due to the exponential rise in power densities and the non-uniform distribution of heat sources. Vapor chambers utilizing liquid-vapor phase change heat transfer are appealing due to their high performance and potentially low cost. However, heat dissipation performance, depending on the thin film evaporation, is limited by the capillary dry-out of wicking structures. Here, we demonstrate a large-scale vapor chamber enabled by high-performance liquid film boiling mode on the hierarchical mesh-wicking structures for high-power electronics cooling. The composite columns integrating with copper foam and copper powder are patterned in a zoned configuration to promote vapor diffusion and two-phase flow. The effects of the filling rate and cooling water temperature on the vapor flow and liquid film distribution are investigated. The results show that the X-shaped distribution of composite columns in the heat source region promotes the vapor diffusion throughout the vapor chamber, resulting in a thermal resistance of 0.04°C/W at the heat flux of 100 W/cm2 from an area of 775 mm2. The findings provide theoretical guidance for the structure design of high-performance large vapor chambers.

Key words： large-scale vapor chamber; liquid film boiling; composite wicking structure; high heat flux; low thermal resistance

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