A Detailed Thermal Resistance Network Analysis of FCBGA Package

DANG Hao, LU Yang, DU Yanzheng, ZHANG Xiu, ZHANG Qian, MA Weigang, ZHANG Xing

热科学学报 ›› 2024, Vol. 33 ›› Issue (1) : 18-28.

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热科学学报 ›› 2024, Vol. 33 ›› Issue (1) : 18-28. DOI: 10.1007/s11630-023-1903-y

A Detailed Thermal Resistance Network Analysis of FCBGA Package

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A Detailed Thermal Resistance Network Analysis of FCBGA Package

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{{article.zuoZheCn_L}}. {{article.title_cn}}[J]. {{journal.qiKanMingCheng_CN}}, 2024, 33(1): 18-28 https://doi.org/10.1007/s11630-023-1903-y
{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2024, 33(1): 18-28 https://doi.org/10.1007/s11630-023-1903-y
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